Aerospace and defense technology company Hermeus has announced the official launch of its High Enthalpy Air-Breathing Test Facility (HEAT) following a series of successful tests of the Pratt & Whitney F100 engine. Developed to address the critical shortage of
Continue Reading
Interlink Electronics, Inc., experts in the design, development, and manufacture of advanced sensors and printed electronic solutions, has announced its receipt of a $150,000 NASA Phase 1 SBIR award. The funding will support the company’s efforts to develop
Continue Reading
Voyant Photonics, developers of LiDAR-on-a-chip solutions for 3D sensing, have announced the availability of CARBON, a Frequency Modulated Continuous Wave (FMCW) LiDAR sensor featuring a highly integrated silicon photonic chip.
Continue Reading
Teledyne Space Imaging has been awarded the role of Prime Contractor for the Constellation Acquisition Sensor (CAS) instrument on ESA’s Laser Interferometer Space Antenna (LISA) mission. This groundbreaking initiative will establish the first space-based observatory dedicated to studying gravitational
Continue Reading
GlobalFoundries has joined the LOT Network, a global non-profit patent licensing platform that protects its members from litigation by patent assertion entities (PAEs), commonly referred to as “patent trolls.” Semiconductor leader joins the world’s largest patent protection community to shield customers and the ecosystem from patent assertion entities. This move places GF among more than […]
Continue Reading
Hexagon has announced its acquisition of the Geomagic software suite from 3D Systems. This acquisition strengthens Hexagon Manufacturing Intelligence’s software portfolio by adding advanced 3D modeling and inspection tools.
Continue Reading
Bosch, a global leader in semiconductor and automotive technologies, has signed a preliminary memorandum of terms (PMT) with the U.S. Department of Commerce, securing up to $225 million in proposed direct funding under the CHIPS and Science Act. This funding will support Bosch’s
Continue Reading
DigiKey, a global distributor of electronic components and automation products, has announced that it has signed a global sales and distribution agreement with MediaTek, the world’s fifth-largest fabless semiconductor company.
Continue Reading
Ayar Labs, global experts in optical interconnect solutions for large-scale AI workloads, has announced that it has successfully raised $155 million in Series D funding address the bottlenecks in data movement for AI infrastructure with its optical I/O technology.
Continue Reading
CEA-Leti researchers have developed the first device capable of both sensing and modulating light within a single unit. This innovation integrates a liquid crystal cell with a CMOS image sensor, enabling a compact and scalable system with intrinsic optical alignment. The breakthrough is expected to drive the adoption of digital optical phase conjugation (DOPC) techniques […]
Continue Reading