Teledyne CCD325 imaging detector used aboard ESA’s FLEX satellite for plant-fluorescence measurements, Sensors + Testing Monthly.

Teledyne Space Imaging CCDs Support ESA Earth Missions

Teledyne Space Imaging CCD detectors have launched aboard two European Space Agency Earth observation missions, placing two distinct imaging-sensor architectures into orbit for long-term monitoring of Earth’s oceans, land surfaces and vegetation. Sentinel-3C and the Fluorescence Explorer, or FLEX, launched together aboard a Vega-C rocket from Europe’s Spaceport in French Guiana on Sept. 15, with […]

Continue Reading
Product view of a sensiBel optical MEMS microphone incorporating optoKore optical-detection technology, Sensors + Testing Monthly.

sensiBel, X-Celeprint Scale Optical MEMS Microphone Production

sensiBel, a Norwegian developer of optical MEMS acoustic sensing technology, has entered a manufacturing partnership with X-Celeprint to scale production of the optical-detection technology used within its optical MEMS microphones. The collaboration applies X-Celeprint’s Micro-Transfer Printing (MTP) process to sensiBel’s optoKore™ module, moving production of the heterogeneous optical assembly toward wafer-level manufacturing as the Norwegian […]

Continue Reading
Yokogawa optical spectrum analyzer used for laser validation at Integrated Optics | Sensors + Testing Monthly

Yokogawa Spectrum Analyzer Supports Laser Validation

Integrated Optics, a Lithuania-based manufacturer of ultra-compact laser sources, is using Yokogawa optical spectrum analysis to support product development, spectral validation and production quality control across its visible and near-infrared laser portfolio. The company selected Yokogawa’s AQ6373E optical spectrum analyzer to detect weak spectral modes, and other low-level components close to the primary laser signal, […]

Continue Reading
PI (Physik Instrumente) P-733 XYZ piezo nanopositioning stage for AFM and surface metrology | Sensors + Testing Monthly

PI XYZ Piezo Stage Delivers Angstrom-Level Resolution

PI (Physik Instrumente), a global designer and manufacturer of precision motion and nanopositioning technologies, has introduced its P-733 XYZ piezo nanopositioning stage for atomic force microscopy, surface nanometrology, advanced imaging and other applications requiring sub-nanometer positioning. Depending on configuration, the P-733 family provides system resolution down to 0.1 nm, or 1 Å, using capacitive position […]

Continue Reading
Five AI autonomous vehicle simulation featuring VW van | Sensors + Testing Monthly

Five AI Develops Photorealistic AV Simulation Technology

Five AI, the UK-based artificial intelligence and automated vehicle technology company wholly owned by Bosch, has announced plans to develop new photorealistic simulation technology designed to accelerate the testing and validation of advanced driver assistance and autonomous vehicle systems. Developed in Cambridge, UK, the new simulation technology will combine Gaussian scene reconstruction with generative AI […]

Continue Reading
CANoe AI-powered development and testing environment from Vector Informatik GmbH | Sensors + Testing Monthly

Vector Informatik GmbH Adds AI Test Automation to CANoe

Vector Informatik GmbH, a developer of software-defined systems and engineering tools, has announced new AI and Model Context Protocol capabilities for its CANoe development and testing environment. With the new capabilities, engineers can automate complete workflows from requirements through test validation. Users can enter development, analysis and testing requirements as natural-language prompts. Specialized AI agents […]

Continue Reading
Synopsys autonomous engineering software for chip verification and simulation featured by Sensors + Testing Monthly

Synopsys Advances Autonomous Engineering Workflows

Synopsys, global industry experts in electronic design automation and engineering simulation, has introduced autonomous engineering workflows developed with NVIDIA technology to accelerate chip verification, electronics thermal analysis and multiphysics simulation. Demonstrated for the first time at the 2026 DAC Chips to Systems Conference, the new capabilities are designed to move engineering teams beyond individual AI-assisted […]

Continue Reading