iNGage, a fabless provider of high-performance multi-axis inertial MEMS navigation sensors for autonomous systems, has announced the successful close of its €6 million ($7 million) seed funding round. The financing will accelerate commercialization of the company’s breakthrough MEMS technology, capable of delivering tactical-grade navigation performance in GNSS-denied environments. The round was led by Supernova Invest and 360 Capital, with participation from BNP Paribas Développement, Crédit Agricole Alpes Développement, and CEA Investissement.

Based in Grenoble, France, with a design team in Milan, Italy, iNGage develops ultra-integrated, multi-axis inertial sensor components for deployment in Attitude and Heading Reference Systems (AHRS), Inertial Measurement Units (IMUs), and Inertial Navigation Systems (INS). These compact devices enable precise guidance, control, and navigation when Global Navigation Satellite System (GNSS) signals are weak or unavailable — such as in tunnels, dense cities, forests, or in conditions affected by spoofing and jamming.

Rendering of iNGage high-sensitivity MEMS inertial sensor featuring patented piezoresistive nano-gauge detection for GNSS-free navigation applications appearing in an article on Sensors and Testing Monthly

Close-up rendering of an iNGage MEMS inertial sensor designed for high-performance navigation applications. The company’s patented piezoresistive nano-gauge detection principle offers ten times greater sensitivity and twice the compactness of traditional MEMS capacitive technology. (Photo courtesy of iNGage)

Conventional capacitive MEMS sensors often suffer from drift, while fiber-optic gyroscopes (FOGs) and high-end inertial systems remain costly and bulky. iNGage bridges that gap with a patented piezoresistive nano-gauge detection principle that is ten times more sensitive and twice as compact as traditional capacitive MEMS. This innovation enables positioning accuracy of roughly 50 centimeters after several minutes of high-speed driving without GPS — compared to several meters of error within seconds using current MEMS technologies.

“The beauty and the differentiation of our approach is combining three high-performance gyros and three accelerometers on a single component — delivering tactical-grade performance and supporting European technological sovereignty,” said Philippe Robert, Co-founder and CEO of iNGage. “This technology has been confined too long either in smartphones and cars with limited performance, or in aerospace-grade systems with high costs.”

The seed funding will support the finalization of two key inertial sensor components: a miniature, high-performance three-axis gyroscope and a six-degree-of-freedom (6-DOF) inertial sensor capable of measuring acceleration and angular velocity across all axes with exceptionally low noise and bias stability. Integration of these sensors on a single chip will significantly reduce system size, power consumption, and cost, while advancing the resilience of sensor-fusion systems across defense, industrial, and automotive markets.

Founded in 2025, iNGage builds upon over 15 years of collaborative research from CEA-Leti (France) and Politecnico di Milano (Italy). With more than 30 licensed patents protecting its technology portfolio, iNGage continues to strengthen Europe’s position in next-generation MEMS sensor innovation.

About iNGage

Based in Grenoble, France, and Milan, Italy, iNGage is a start-up company commercializing disruptive, high-performance MEMS inertial sensors (accelerometers, gyroscopes, IMUs) and pressure sensors designed for GPS-free navigation in autonomous mobility systems. Developed from patented technology created at CEA-Leti in partnership with Politecnico di Milano (PoliMi), iNGage’s solutions push the limits of MEMS navigation performance to make tactical-grade precision accessible to high-volume applications, including industrial robotics, automotive, and defense. The company’s patented piezoresistive nano-gauge detection principle delivers performance that is ten times more sensitive and twice as compact as traditional MEMS capacitive technology. For more information, please click here.

Source: iNGage


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Molly Bakewell Chamberlin
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