New 3D Sensor Series from AT-Automation Technology

Machine Vision Sensors, Switches and Feedback Devices

AT-Automation Technology GmbH, headquartered in Bad Oldesloe, Germany, has announced the global launch of its XCS Series, a family of high-speed, high-precision 3D sensors for advanced machine vision applications.

AT-Automation Technology GmbH high speed, high precision 3D sensors, the XCS series for advanced machine vision applications, in an article appearing on Industrial Automation Monthly.
AT-Automation Technology GmbH has introduced its XCS series, a family of high-speed, high-precision 3D sensors for advanced machine vision applications.

The XCS Series features an optimized laser that produces a homogeneous line thickness, enabling the precise scanning of smaller structures and components. The laser, protected by AT-Automation Technology’s Clean Beam technology, ensures consistent and reliable results with uniform intensity distribution. Each sensor utilizes a 3R class laser with a 405 nm wavelength.

The series includes a dual-head option for high speed and resolution, eliminating occlusions. All XCS Series sensors are equipped with a number of standard features, including Automatic Region Tracking, Automatic Region Search, Multiple Regions, MultiPart, AutoStart, History Buffer, Multi-Slope, and MultiPeak.

In addition, XCS Series sensors offer a small field of view (FOV). The 3070 and 3070 WARP models provide a 48 mm FOV, 3072 pixels per profile resolution, and profile speeds up to 140 kHz. The 4090 models offer a 53 mm FOV with 4096 pixels per profile resolution and profile speeds up to 20.3 kHz. All sensors include a 1GigE interface and comply with GenICam and GigE Vision standards.

Encased in IP67-rated anodized aluminum housing, the sensors can operate over a standard temperature range from 0°C to 40°C and up to 80 percent relative humidity.

The XCS Series is particularly suitable for high-performance applications in the electronics industry, such as the inspections of electronic components, assemblies, and connector pins. In addition, their optimized laser with homogeneous thickness ensures accurate inspections of smaller structures, such as ball grid arrays (BGAs). The Clean Beam function protects the laser from external interference, ensuring uniform intensity distribution and increased reliability. The dual-head option in the 3070-WARP model eliminates occlusions and achieves profile speeds up to 200 kHz, enhancing data analysis and efficiency.

Click here for detailed technical specifications, pricing, and additional information.

Source: AT-Automation Technology GmbH

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